Diferans ant keratin soude tanperati ki wo ak keratin soude tanperati ki ba

Anjeneral pale, keratin soude tanperati ki wo jeneralman konpoze de fèblan, ajan, kòb kwiv mete ak lòt eleman metal, ak pwen k ap fonn konvansyonèl yo pi wo a 217 degre. Nan pwosesis la chip ki ap dirije, fyab nan gwo -tanperati plon- keratin soude gratis se relativman wo, epi li pa fasil pou desoude ak krak.

Pwen k ap fonn nan keratin soude konvansyonèl ba -tanperati a se 138 degre. Lè konpozan yo nan patch la pa ka kenbe tèt ak tanperati a nan 200 degre oswa pi wo ak pwosesis la patch reflow obligatwa, yo dwe itilize keratin soude tanperati ki ba - pou pwosesis la soude. Li pa ka kenbe tèt ak segondè -tanperati reflow soude orijinal la ak PCB. Konpozisyon alyaj li yo se alyaj fèblan bismit. Tanperati pik nan soude reflow nan keratin soude tanperati ki ba se 170-200 degre.

Kote soude tanperati ki wo:

1.Li gen bon enprime woule ak fèblan jete pèfòmans, epi li kapab tou ranpli enprime egzat pou kousinen ak yon espas osi ba ke 0.3mm.

2. Several hours after the solder paste is printed, it still maintains its original shape without collapse, and the patch elements will not be offset.

3. It can meet the requirements of different grades of welding equipment, does not need to complete welding in nitrogen filled environment, and can still show good welding performance in a wide range of reflow furnace temperature.

4. The residue of high-temperature solder paste after welding is very little, colorless, has high insulation resistance, will not corrode PCB, and can meet the requirements of no cleaning.

5. It can be used in paste in hole process.

Ba tanperati soude keratin:

1. Excellent printability, eliminating omission, depression and fast knot in the printing process.

2. Good wettability, bright, uniform and full solder joints.

3. Suitable for wide process and fast printing.

4. Fully comply with ROHS standards.

       High temperature solder paste is suitable for high temperature welding components and PCB; Low temperature solder paste is suitable for components or PCBs that cannot withstand high temperature welding, such as heatsink module soldering, led soldering, high frequency welding and so on.

     The alloy composition of high temperature solder paste is generally tin, silver and copper (SAC for short); The alloy composition of low-temperature solder paste is generally Sn Bi series, including various alloy components such as SnBi, snbiag and snbicu. Sn42bi58 is a eutectic alloy with a melting point of 138 degree , and other alloy components have no eutectic point and different melting points.