Konesans debaz nan simulation tèmik

      With the rise of the electronic industry, the control of various electronic heating has become extremely important, such as the heat dissipation of mobile phone chips, the heat dissipation of computer hosts, the heat dissipation of electronic components, etc. Therefore, how to effectively simulate the temperature distribution of electronic components is very important. At present, there are many thermal simulation software in the market, such as Flotherm, SEMS, PLM, Icepak, fluent, etc. The simulation results combined with the actual design can effectively and quickly obtain ideal products.

     The first law of thermodynamics tells us that heat is conserved, which means, the heating capacity of the object in the system will be equal to the heat absorption capacity of the object in the system; There are three ways of heat transmission: 1. Heat conduction; 2. Thermal convection; 3. Thermal radiation. Therefore, when designing and simulating the thermal system, we must understand the heat propagation mode of the flow field.

     For example, if the flow field with weak convection mainly depends on heat conduction for heat dissipation, the connection of the structure is very important, such as thermal impedance setting, structural propagation path design, etc; At the same time, the influence of gravity will be great, and the flow field in natural convection is easily disturbed by gravity. If it is forced convection, the flow field velocity is very large. At this time, it is very important to design the flow channel and simulate the fluid state. Gravity and radiation have little effect on the temperature, and the structural conduction is also very important, which can not be ignored. Assuming that the heat dissipation mode is thermal radiation, it shows that the temperature difference between the heat source and the surrounding environment is large, and the heat is mainly radiated to the surrounding through air. Therefore, in the actual simulation process, the thermal simulation analysis should be simulated in combination with the actual project.

Pwen sa yo ta dwe note nan simulation tèmik la:

1.  Clear heat conduction path;

2.  Clear the flow path;

3.  Understand the physical meaning of each module. For example, the heat source should not only be the simulation of the heat source, but also know how it propagates heat in space, that is, how the heat conductivity is defined;

4.  The results obtained shall be carefully checked to see if there is any macroscopic abnormality or does not conform to the actual physical meaning; From the microscopic point of view, we can analyze the order of magnitude of heat, such as the three conserved orders of magnitude, the error between the measured data and so on.